%0 Journal Article
%4 dpi.inpe.br/plutao/2012/06.21.16.58
%2 dpi.inpe.br/plutao/2012/06.21.16.58.24
%@doi 10.1155/2012/213420
%@issn 2090-3529
%@issn 1452-3981
%F lattes: 7595333636841849 6 MatsushimaFeCoBaFeBa:2012:InCuBi
%T Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate
%D 2012
%A Matsushima, Jorge T.,
%A Fernandes, Valéria C.,
%A Couto, Andrea B.,
%A Baldan, Maurício Ribeiro,
%A Ferreira, Neidenêi Gomes,
%@affiliation
%@affiliation Instituto de Pesquisa Energéticas e Nucleares—IPEN
%@affiliation
%@affiliation Instituto Nacional de Pesquisas Espaciais (INPE)
%@affiliation Instituto Nacional de Pesquisas Espaciais (INPE)
%@electronicmailaddress jtmatsushima@yahoo.com.br
%@electronicmailaddress
%@electronicmailaddress
%@electronicmailaddress baldan@las.inpe.br
%@electronicmailaddress neidenei@las.inpe.br
%B International Journal of Electrochemistry
%V 2012
%P 1-10
%K Cu/Pd bimetallic system, diamond films, electrocatalytic, morphological analysis.
%X The Cu/Pd bimetallic system electrodeposited on boron-doped diamond (BDD) films for application, as electrode material in the electrochemical reduction of nitrate was studied. The electrochemical behavior of Cu, Pd, and Cu/Pd bimetallic system was evaluated by cyclic voltammetry. From these results, the formation of the Cu/Pd composite was verified. In addition, Cu with different phases and a Cu/Pd phase in the composite were obtained. Morphological analysis by scanning electron microscopy (SEM) revealed a homogeneous distribution of Cu/Pd bimetallic particles with intermediary dimensions compared to those observed in Cu or Pd electrodeposits separately. These composites were tested as electrocatalysts for nitrate reduction in Britton-Robinson buffer solution (pH 9). Electrochemical measurements showed that composites with higher Cu content displayed the best electrocatalytic activity for nitrate reduction, and the Cu/Pd phase in the bimetallic system served to improve the Cu adherence on BDD electrode.
%@language en
%3 213420.pdf